Power Adhesives TEC Bond 7784 Polyamide Glue Sticks
Product Highlights
- Type: Hot Glue Sticks
- Brand: Power Adhesives
- Adhesive Temperature: High Temperature
- Glue Compatibility: 1/2" Glue Sticks
- Set Speed: Medium
- Bonds: Cardboard, General, Plastic, Wood, General Purpose
- Properties: Polyamide
- Application: Electrical, Flooring, Woodworking & Furniture
About TEC Bond 7784 Polyamide Glue Sticks
The TEC Bond 7784 polyamide hot melt glue sticks have a medium open time and high temperature resistance making them good for potting and woodworking applications. The 7784 also comes in a variety of colors and sizes to match your application and glue gun type.
Additional Information
- Standard 1/2" Glue Sticks
- Excellent Temperature Resistance
- Used for Hot Melt Potting and Woodworking
TEC Bond 7784 Glue Stick Specifications
|
Form |
½” x 10” |
⅝” x 10” |
1¾” x 1¾” |
Prills |
|
Sticks per lb (approx) |
18 |
11 |
8 |
|
|
Carton quantity |
22lb (4x5.5lb foil pack) |
22lb (4x5.5lb foil pack) |
22lb (tub) |
44lb |
|
Alternative Pack |
10x10 stick pack |
10x6 stick pack |
||
|
Pallet weight: |
1100lb |
1100lb |
1100lb |
2200lb |
|
Suggested application temperature |
380-420ºF |
380-420ºF |
380-420ºF |
380-420ºF |
|
Brookfield viscosity (POW-12-VISC) spindle 27 |
6000cps @ 350ºF |
6000cps @ 350ºF |
6000cps @ 350ºF |
6000cps @ 350ºF |
|
Ring & ball softening point (ASTM E28) |
275ºF |
275ºF |
275ºF |
275ºF |
|
Heat resistance (BS5350 Part H3) |
220ºF |
220ºF |
220ºF |
220ºF |
|
Open time |
Medium |
Medium |
Medium |
Medium |
|
Low temperature flexibility (tg) |
-76ºF |
-76ºF |
-76ºF |
-76ºF |
TEC Bond 7784 Data Sheets
Power Adhesives TEC Bond 7784 Technical Data Sheet (TDS)
Power Adhesives TEC Bond 7784 Safety Data Sheet (SDS)
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