TEC Bond 2131F Bookbinding Bulk Hot Melt
Product Highlights
- Type: Bulk Hot Melt
- Brand: Power Adhesives
- Bonds: Cardboard, Plastic, Wood
- Application: Bookbinding
OVERVIEW
TEC Bond 2131F was developed for the bookbinding industry, specifically for side gluing. The 2131F is a semi-pressure sensitive hot melt giving a very long open time and good adhesion to many surfaces including coated and glossy stock.
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SPECS
Power TEC Bond 2131F Specs
- Color: Pale Amber
- Suggested Application Temp: 320F
- Brookfield Viscosity: 4,000 cps
- Softening Point: 190F
- Form: Pastilles
MSDS & TDS
Power TEC Bond 2131F MSDS & TDS Sheets
- 2131F TDS
- Contact Us for MSDS
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