TEC Bond 2131F Bookbinding Bulk Hot Melt

SKU: 2131-BKU-ARA-BX15-TEC

Price:
Sale price$153.00

Product Highlights

  • Type: Bulk Hot Melt
  • Brand: Power Adhesives
  • Bonds: Cardboard, Plastic, Wood
  • Application: Bookbinding

OVERVIEW

TEC Bond 2131F was developed for the bookbinding industry, specifically for side gluing. The 2131F is a semi-pressure sensitive hot melt giving a very long open time and good adhesion to many surfaces including coated and glossy stock. 

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    SPECS

    Power TEC Bond 2131F Specs

    • Color: Pale Amber
    • Suggested Application Temp: 320F
    • Brookfield Viscosity: 4,000 cps
    • Softening Point: 190F
    • Form: Pastilles

      MSDS & TDS

      Power TEC Bond 2131F MSDS & TDS Sheets


           

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