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TEC Bond 2131F Bookbinding Bulk Hot Melt

Product Highlights

Brand:
  • Power Adhesives
By Application:
  • Bookbinding

Bonds To
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Cardboard
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Wood
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Plastic
Case Size: 2131- 33lbs
SKU: 2131-BKU-ARA-BX15-TEC
$145.00
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TEC Bond 2131F Bookbinding Bulk Hot Melt

OVERVIEW

TEC Bond 2131F was developed for the bookbinding industry, specifically for side gluing. The 2131F is a semi-pressure sensitive hot melt giving a very long open time and good adhesion to many surfaces including coated and glossy stock. 

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    SPECS

    Power TEC Bond 2131F Specs

    • Color: Pale Amber
    • Suggested Application Temp: 320F
    • Brookfield Viscosity: 4,000 cps
    • Softening Point: 190F
    • Form: Pastilles

      MSDS & TDS

      Power TEC Bond 2131F MSDS & TDS Sheets