- Type: Bulk Hot Melt
- Brand: Power Adhesives
- Adhesive Temperature: High Temperature
- Set Speed: Fast
- Bonds: Cardboard, Foam
- Application: Packaging
About the Power Adhesives TEC Bond 7731F Bulk Hot Melt
TEC Bond 7731F is a fast setting bulk hot melt formulated for packaging and carton closing applications giving a strong, fast bond to cardboard, paper, wood and other porous substrates. The 7731F by Power also gives good bond strength at lower temperatures.
7731F is also used in microwaveable packaging, but we recommend testing as cook times and package designs obviously vary.
Contact Us for bulk pricing and samples.
Power TEC Bond 7731F Specs
- Color: Pearl
- Suggested Application Temp: 280-320F
- Viscosity @ 250F: 840 cps
- Softening Point: 230F
- Form: Pastilles
Power TEC Bond 7731F MSDS & TDS Sheets
Questions about this product? Our application specialists can help. Submit your questions and we'll get you answers right away.
Guaranteed Safe Checkout
Your payment information is processed securely. We do not store credit card details nor have access to your credit card information.