Infinity Bond EP H70E Epoxy Syringes Pre-Mixed and Frozen

Infinity Bond EP H70E Epoxy Syringes Pre-Mixed and Frozen

Infinity Bond EP H70E is a two-component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. 

Features & Applications

• Heat-sinking adhesive recommended for thermal management applications where good heat dissipation is necessary. 
• Outstanding handling characteristics and long pot life at room temperature. No solvents added. 
• This product can be screen printed, machine dispensed, stamped, or hand applied. 
  
• Die-attach adhesive designed to be used in the 300C range to resist TC wire bonding operations. 
• Excellent adhesion to ferrous and non-ferrous metals, lead-frame die paddle, glass, ceramic, kovar, and PCB. 
• Can be cured very rapidly, excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.  

Sizes Available

Pre-mixed syringes: 3cc, 5cc, 10cc, 30cc. Syringes are shipped on dry ice at -80°C.

Alternative to EPO-TEK® H70E

Infinity Bond EP H70E is a direct replacement for EPO-TEK® H70E epoxy adhesive. If you have questions about switching from EPO-TEK® H70E to Infinity Bond EP H70E, don't hesitate to contact us. 

Specifications