Power TEC Bond 7731F Bulk Hot Melt
TEC Bond 7731F is a fast setting bulk hot melt formulated for packaging and carton closing applications giving a strong, fast bond to cardboard, paper, wood and other porous substrates. The 7731F by Power also gives good bond strength at lower temperatures.
7731F is also used in microwaveable packaging, but we recommend testing as cook times and package designs obviously vary.
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Power TEC Bond 7731F Specs
- Color: Pearl
- Suggested Application Temp: 280-320F
- Viscosity @ 250F: 840 cps
- Softening Point: 230F
- Form: Pastilles
See more: Bulk Hot Melt
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