TEC Bond 4602F Bulk Hot Melt
Product Highlights
- Type: Bulk Hot Melt
- Brand: Power Adhesives
- Bonds: Cardboard, Foam
- Application: Packaging
OVERVIEW
TEC Bond 4602F is an extremely high performance, heat stable (in both high and low temperatures) bulk hot melt for the packaging industry. The 4602F offers very low odor and clean machining with low char and fewer filter and nozzle blockages.
The 4602F is also FDA approved for food and microwave packaging.
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SPECS
Power TEC Bond 4602F Specs
- Color: White
- Suggested Application Temp: 320F
- Brookfield Viscosity: 1,700 cps
- Softening Point: 225F
- Form: Pastilles
MSDS & TDS
Power TEC Bond 4602F MSDS & TDS Sheets
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