TEC Bond 5931F Bulk Freezer Grade Hot Melt
TEC Bond 5931F is a freezer grade packaging hot melt offering excellent adhesion to a wide range of materials meant to be in deep freezer environments like boards and papers. The 5931F remains flexible all the way down to -40 Degrees F.
The 5931F is a high performance hot melt giving good, clean machining with low char and clogging. It can also be used where a fast melt down tank is required.
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Power TEC Bond 5931F Specs
- Color: Pale White
- Suggested Application Temp: 320F
- Brookfield Viscosity: 1,100 cps
- Softening Point: 190F
- Form: Prills
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