Glue for Electrical Potting
About Electrical Potting and Encapsulation Adhesives
In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound for resistance to shock and vibration and excluding moisture and corrosive agents. For potting and encapsulation applications, low viscosity adhesives are generally preferred. They allow better fill around electronic components and reduce the likelihood of air bubble entrapment.
Epoxy for Electrical Potting - Industry Standard
Epoxy has wide popularity among electronic industries due to its excellent electrical and mechanical properties. Epoxy also offers protection against chemicals and high temperatures. Use epoxy when you need a time-tested solution with good protection against water, acids, bases, and organic solvents.
Silicone for Electrical Potting - Flexible & High Temp Resistant
Silicone potting compounds and encapsulating materials are soft, flexible, and have superior resistance to degradation at high temperatures. Use a silicone adhesive when you need high temperature resistance and a flexible outcome.
Hot Melt - Easy to Use and Cost-Effective
Hot Melt adhesives are easy to use and have a super long shelf life. There is minimal waste and no need for mixing. Hot melt adhesives are usually your most cost-effective solution. Use hot melt for electrical potting when you need an easy fool-proof solution.
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Best Overall: Infinity EP 270 Black Universal Potting Epoxy - 60 Minute Open Time
EP 270 Epoxy is non-corrosive, low viscosity, and medium-slow cure making it our top-selling epoxy adhesives for potting applications. It is easy to apply and is cost-effective.View Details
All Glue for Electrical Potting
Potting is essentially filling a "pot" with adhesive (often referred to as a potting compound). When potting electronics, the components to be potted are in a housing or recess which is then filled with adhesive.
Electronic circuit boards comprise many sensitive small components such as microchips, resistors, transistors and diodes. These often require protection against moisture (which can cuase short circuits), chemicals (which can corrode or attack components), thermal shock, vibration or impact (which can cause components to become detached). In many cases, potting electronic parts help make copying circuitry difficult for competitors or helps make smart chips and card readers harder for criminals to tamper with.
For potting applications, low viscosity adhesives are generally preferred. They allow better fill around electronic components and reduce the likelihood of air bubble entrapment. Two-part epoxies and modified epoxies are a popular choice as are polyurethane adhesives and silicones. UV-adhesives can be used as they offer a quick cure and don't require mixing; however shadow areas and limited depth cure means they often aren't suitable. There are UV adhesives available with a secondary cure method which can assist full cure in shadow areas.
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